Job Family Overview

Intel's Optical Engineers are leading the 400G-market transition and driving innovation for next generation of optical interconnect products.

An Insight into What You'll Do

A career at Intel is about using and developing your skills to achieve amazing possibilities. As an Optical Engineer, you will develop  packaging design for state of the art Silicon Photonics SiPh devices and assemblies, with emphasis on mirco-optics, optoelectronic component and sub-systems. You'll be called upon to drive the package designs and technology selection by assessing and mitigating risks associated with the product designs, and partner with stakeholders to identify new suppliers for design, develop and manage existing suppliers.

This team also works on designs from concept to volume production, ensuring the product passes all requiriements and measures along the way. You'll perform tolerance analysis of opto-mechanical components and subassemblies, as well as:

  • Generate optical and opto-mechanical component specifications, layouts, assembly drawings for product and tooling.
  • Design optical systems and optimize design thru. optical simulation.- Lead or support developing assembly and test method to validate the design.
  • Define inspection and validation methods to test optical component and systems performance
  • Work with Manufacturing Ops team on managing and developing the full Bill of Materials, and analyzing data to optimize yield.

An Insight into What You'll Bring

This is your opportunity to work with an exciting emerging technology with brilliant minds from around the world. A successful candidate will possess a high degree of skill and experience. Including: New product introduction/Process development skills, transfer process development learning, problem-solving and manufacturing yield improvement.

Proficiency in opto-packaging design including design of fixtures, tolerance stack management through intelligent fixture design, alignment tools to enable intelligent active and passive alignment processes.

Experience designing and qualifying high volume single mode products, specify sub-component lens, isolator, fiber assembly, etc. specifications including tolerances.

Hands-on process development experience for optical alignments - lens and fiber, UV & thermal epoxy curing, epoxy bond line control, flip chip die bonding, wire bonding of laser and photodiode chips on substrate, solder processes, etc.

Solid knowledge of incoming and outgoing quality control.

Hands-on experience with product manufacturing yield improvement and quality control with Statistical Process Control.