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Job ID: JR0212172
Job Category: Intern/Student
Primary Location: Phoenix, AZ US
Other Locations: Virtual US
Job Type: Intern

Failure analysis GRADUATE Intern

Job Description

Responsibilities may be quite diverse of a nonexempt technical nature.
U.S. experience and education requirements will vary significantly depending on the unique needs of the job.

Job assignments are usually for the summer or for short periods during breaks from school.

This is an internship and compensation will be given accordingly based on candidate education level and internship duration.

Candidate will be performing modeling / simulations and conducting experimental testing to understand fundamental interactions between different packing materials and Radio Frequency (RF) signals.


In addition, the candidate will perform data collection across various Intel products and Test vehicles, correlate experimental data with simulations and critically evaluate test results and understand any deviations and propose improvements to the test setup.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.
Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

Must be pursuing a PHD Degree in in Electrical Engineering/Electronics or related fields of study with 1+ years’ experience in the following:

  • Radio Frequency Electromagnetics/Microwave research areas.

  • Radio Frequency  Electromagnetic simulation/modeling tools.


Preferred Qualifications:

  • Knowledge of electronic packaging and materials and Integrated circuit design.

  • Background in thermal transport/modeling.

  • Experience in using ANSYS.

This position is not eligible for Intel immigration sponsorship.
 

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.



Other Locations

Virtual US


Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Annual Salary Range for jobs which could be performed in Colorado or New York:
$52,000.00-$147,000.00


Benefits:
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, and benefit programs. Find more information about our Amazing Benefits here

Work Model for this Role

This role will require an on-site presence.

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