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Job ID: JR0205453
Job Category: Engineering
Primary Location: Hillsboro, OR US
Other Locations:
Job Type: Experienced Hire

Thermal Engineer

Job Description

Become a member of one of the largest engineering companies in the world. In this position, you will be a member of the Thermal Mechanical Systems team in the Data Center and AI Group. With your technical background in thermal engineering, you will be responsible for all aspects of the thermal engineering development of system and component thermal solutions for air and liquid cooled environments. You will be delivering advanced cooling technologies required to meet the thermal challenges of server multi-chip xPU packages, chipsets and other components.

As a key contributor in the thermal development process, you will work closely with partner groups and organizations including silicon teams, quality, supplier engagement, silicon packaging and customer interface. You will be responsible for establishing xPU thermal specifications and working with silicon teams to develop solutions that provide thermally optimized silicon with the most efficient system boundary conditions.

The ideal candidate should exhibit the following behavioral traits:

Interpersonal, communication, problem solving and analytical skills. Comfortable working independently in a fast-paced environment.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a positive factor in identifying top candidates. Requirements listed may be obtained through a combination of industry relevant job experience, internship experiences, and/or schoolwork/classes/research.

Minimum Requirements:

The candidate must have a Bachelor's of Science degree with a minimum of 5+ years of industry experience or Masters of Science degree with 3+ years of industry experience or a PhD degree with 1+ years of industry experience in Mechanical Engineering or related field.

Minimum Qualifications:

5+ years of experience working with:

  • Heat transfer fundamentals as they apply to electronics cooling.
  • Thermal simulation software (such as Flotherm or Icepak).
  • Hands-on experience of thermal testing techniques.


Preferred qualifications:

  • Experience with CFD tools and overall thermal modeling process.
  • Experience with MATLAB, Labview and statistical methodologies such as Monte-Carlo simulation.
  • Experience in feedback control of dynamic systems is highly desired.
  • Experience with fundamental electrical engineering principles.

Inside this Business Group

The Data Platforms Engineering and Architecture (DPEA) Group invents, designs & builds the world's most critical computing platforms which fuel Intel's most important business and solve the world's most fundamental problems. DPEA enables that data center which is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.


Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

USExperienced HireJR0205453
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