This position is associated with the sale of Intel's NAND memory and storage business to SK hynix (You can read more about the transaction in the press release - https://newsroom.intel.com/wp-content/uploads/sites/11/2020/10/nand-memory-news-q-a.pdf). The transaction will enhance the resources and potential of the business' storage solutions, including client and enterprise SSDs, in the rapidly growing NAND Flash space amid the era of big data.
This is an exciting time to be at Intel - come join our team as a Process Engineer and work on one of the most advanced 3DNAND and SSD technology portfolios in the world. As the global leader in the semiconductor industry, Intel possesses many industry-leading SSD technologies including the most capable Quadruple Level Cell (QLC) NAND Flash products.
As a Process Engineer, you will be part of a world-class team that will transition to lead the SSD business at SK hynix.
This position aligns to Phase 2 of the transaction, which includes NAND technology and component development along with fab operations. Employees aligned to Phase 2 will continue to be employed by Intel and will continue to develop NAND technology and components and manufacture NAND wafers at the fab. Phase 2 of the transaction is expected to close in March 2025, at which time employees aligned to this phase of the transaction will transition employment to SK hynix.
Process engineers in the Architecture and Technology Scaling (ATS) group are expected to understand the supplier landscape, develop and execute to process and equipment config. roadmaps to meet 3D NAND BU's long-term technology and cost requirements. ATS group meets early phase development objectives through strategic programs set up with suppliers, recommends appropriate technology and supports the transfer of technology to TD in Dalian fab in China.
The ideal candidate should demonstrate the following behavioral traits:
Work collaboratively with your teammates to come up with the best solution to a problem.
Demonstrated experience to deliver results on multiple projects in a fast-paced, agile environment.
Problem-solving and interpersonal communication skills.
Desire to learn and share knowledge with others.
Influence / negotiate skills with peers and management.
The below minimum qualifications must be met to be considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Masters in an Engineering or Science field.
8+ years of experience developing process on dry etch equipment.
Preferred Skills and Experience.
Demonstrated track record of innovation.
Capability to influence / negotiate with peers and management.
Experience with high Aspect Ratio etches.
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.