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Job ID: JR0144982
Job Category: Engineering
Primary Location: Bangalore, KA IN
Other Locations:
Job Type: Experienced Hire

Silicon Packaging Design Lead Engineer

Job Description
The engineer is responsible for leading the design from the planning phase/early pathfinding to the package tape out of high-density package substrates for Intel Microprocessors and Chipsets. It is expected that the lead has a strong understanding of PCB and package technology aspects, covering electrical, power, thermal, mechanical disciplines. The role requires the engineer to collaborate and work with highly multi-disciplined teams spread across different geos. Must have experience in delivering high-speed PCBs or high density flip chip interconnect based package designs, using Mentor Xpedition or Allegro Tool for physical design.The responsibilities include:- Support the development of pinmap/ballmap, in collaboration with the Senior Package Design, System Hardware, Power Integrity, and Signal Integrity engineers. - Owning the route and fit studies, during the early phase of package definition. - Planning and executing the package substrate design activities, meeting the schedule and quality expectations, throughout the development process cycle. - Driving design reviews with stakeholders


Qualifications

Qualifications: Should possess a Bachelor of Engineering or a Master degree of Science/Engineering in the field of Electronics and Communication.. Candidates with strong PCB physical design with good knowledge of Mentor tool will be considered. Experience/Competencies: - 6-8 years of experience in designing PCBs or Packages for high speed products like CPUs/ASICs/Chipsets at least, 2-3 years in leading package design -Exposure to different Package technologies, an advantage - Exposure to Package/Board physical design tool - Mentor Expedition and/or Allegro is needed - Prior experience in using electrical design analysis tools such as Ansoft, HSpice, Sigrity will be added advantage - Must be data-driven and process-oriented and Strong stakeholder management skills - Motivated, self-directed, and able to work effectively, both independently and within a team

Inside this Business Group

The Client Computing Group (CCG) is responsible for driving business strategy and product development for Intel's PC products and platforms, spanning form factors such as notebooks, desktops, 2 in 1s, all in ones. Working with our partners across the industry, we intend to continue to advance PC experiences to deliver the real-world performance people demand. As the largest business unit at Intel, CCG is investing more heavily in the PC, ramping its capabilities even more aggressively, and designing the PC experience even more deliberately, including delivering a predictable cadence of leadership products. As a result, we are able to fuel innovation across Intel, providing an important source of IP and scale, as well as help the company deliver on its purpose of enriching the lives of every person on earth.

INExperienced HireJR0144982
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