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Job ID: JR0169837
Job Category: Engineering
Primary Location: Dalian, Liaoning CN
Other Locations:
Job Type: Experienced Hire

DTD Dry Etch Senior Process Engineer

Job Description

INTEL NSG 3D NAND TD at Intel Dalian is a Technology Development organization to develop future generations of 3D NAND process technologies through innovation product enhancement as well as developing and enabling equipment and process capabilitiesThis job requisition is to seek for strong candidates for the positions of Dry Etch Senior Process Engineer reporting to Dry Etch Area Manager In this position you will work in a dynamic and collaborative environment solving complex and challenging technical problems on sophisticated Dry Etch Processes and Equipment Development You will be responsible for leading technology development enabling manufacture of innovative 3D NAND Memory products Designing executing and analyzing experiments necessary to meet engineering specifications for their process Participate in development of intellectual property Development of the equipment necessary to exploit the understanding gained in development in collaboration with equipment suppliers Work effectively with the equipment supplier to identify shortcomings propose and evaluate hardware modification to mitigate issues Operate manufacturing line in order to integrate the many individual steps necessary for the manufacture of complex 3D NAND memoryThis position is associated with the sale of Intels NAND memory and storagebusiness to SK Hynix You can read more about the transaction in thenbsppress release httpsnewsroomintelcomwpcontentuploadssites11202010nandmemorynewsqapdf The transaction will enhance the resources and potential ofnbspthe business storagenbspsolutions including client and enterprise SSDs in the rapidly growing NAND Flash space amid the era of big data nbspThis is an exciting timenbspto be at Intel come join our NANDDTM and work on the most advanced 3DNAND and SSD technology in thenbspworldnbspAs the global leader in the semiconductor industry Intel possesses industryleading SSD technology and the most capable Quadruple Level CellnbspQLC NAND Flash products and you will be part of a worldclass team that will transition to lead the SSD business at SK HynixThis position aligns to Phase 2 of the transaction which includesnbspNAND technology and component development along withnbspfab operations Employees aligned to Phase 2 will continue to be employed by Intel and will continue to develop NAND technology andnbspcomponents and manufacture NAND wafers at the fab Phase 2 of the transaction is expected to close in March 2025 at which time employees aligned to this phase of the transaction will transition employment to SK Hynixnbsp


Candidate must have demonstrated a track record of excellence in creative problem solving equipment capability enabling or manufacturing process optimization in a relevant engineering organization

Technical Qualifications
MS or PhD in a science or engineering field and minimum 2 years of experience in semiconductor RD environment are required Candidates with different levels of technical experiences will be considered at different grade levels
Broad and deep knowledge of plasma dry etch chambers processes is required
Handson experiences in technology development and technology transfer are highly desired

Other Qualifications
Motivated selfstarter with strong ability to work independently as well as in a team environment
Strong verbal and written communication skills in English
Think and operate independently while simultaneously focusing on many diverse priorities
Flexibility and maturity in facing uncertainties and changing prioritiesresponsibilities
Commit to aggressive goals and win with a cando attitude
Act with velocity and a strong sense of urgency
Respect cultural diversity and sensitivity
Agility in learning improving and innovating

Inside this Business Group

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

CNExperienced HireJR0169837
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