This engineering position is for a Test Capability Development Engineer in the Assembly Test and Technology Development (ATTD) Sort Test Technology Development (STTD) Module Capability Development team.
This diverse team is chartered with enabling new test equipment and module capabilities for all of Intel’s package test manufacturing steps including stress test class test system test and associated supporting metrologies as well as new initiatives such as Radio Frequency (RF) and optical.
Responsibilities include but are not limited to:
-Close partnership with Factory and partner organizations to set development goals and prioritize based on total business value.
-Work with suppliers and strategic planners to develop a capability roadmap and drive solution implementation.
-Requirements and validation plan development for exercising and validating tester hardware and software.
-Integration of tester capabilities into a module test cell and interactions with thermal subsystem handler tooling and product.
-Driving High Volume Manufacturing HVM qualification of new tester capabilities to meet Intel product and manufacturability needs.
-Debugging of test programs tester hardware and software interactions with thermal control software and automation systems.
-Design and debug of tooling collaterals.
The candidate should also exhibit the following behavioral traits and/or skills:
-Troubleshooting and analytical skills.
-Self-motivated driven committed to set and achieve targeted goals.
-Problem-solving skills including DOE structured problem solving or MBPS.
-Communication documentation and presentation skills.
-Leadership and cross organization teamwork skills.
This is an entry level position and compensation will be given accordingly.
You must possess the below minimum qualifications to be initially considered for this position.
Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
Knowledge and/or experience listed below would be obtained through a combination of your school work and/or classes and/or research and/or relevant previous job and/or internship experiences.
Must have the required degree or expect the required degree by Dec 2021.
1+ years of experience in the following:
1+ years of experience on the following:
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.