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Job ID: JR0169153
Job Category: Engineering
Primary Location: Folsom, CA US
Other Locations:
Job Type: College Grad

SSD Thermo-Mechanical Quality and Reliability Engineer Entry Level (-SK)

Job Description

This position is associated with the sale of Intel's NAND memory and storage business to SK hynix. (You can read more about the transaction in the press release - The transaction will enhance the resources and potential of the business' storage solutions, including client and enterprise SSDs, in the rapidly growing NAND Flash space amid the era of big data.

This is an exciting time to be at Intel - come join our Data Center NAND Division as an SSD Thermo-Mechanical Quality and Reliability Engineer and work on the most advanced 3DNAND and SSD technology in the world. As the global leader in the semiconductor industry, Intel possesses industry-leading SSD technology and the most capable Triple Level Cell (TLC) and Quadruple Level Cell(QLC) NAND Flash products. As an SSD Thermo-Mechanical Quality and Reliability Engineer, you will be part of a world-class team that will transition to lead the SSD business at SK hynix.

This position aligns to Phase 1 of the transaction, which includes the 3DNAND enterprise and client SSD business. Phase 1 is expected to close in late 2021, subject to regulatory approvals and other customary conditions. At deal close, all employees aligned to this phase of the transaction will transition to SK hynix.

The Solid State Drive SSD Thermo-Mechanical Quality and Reliability Engineer will be responsible for System level mechanical qualification for Intel Data Center Solid State Drives. The responsibility will include, but not limited to the following:

  • Performing system and package mechanical risk assessments to develop a qualification plan supporting product launch with best in class quality and reliability.

  • Working closely with architecture, design, manufacturing and customer quality teams to gather all relevant inputs and use conditions, to create and execute a qualification plan for the Intel Data Center SSD to achieve company, customer and other reliability objectives.

  • Collection and analysis of all stress test data (dynamics, climatics, solder joint reliability).

  • Manage this process throughout the Product Life Cycle from pathfinding to launch, providing feedback to product development teams that guide system and package design for improved reliability performance and carrying out specific design of experiments to evaluate new technology.

The ideal candidate should exhibit the following behavioral traits:

  • Team player willing to collaborate across multiple functions.

  • Verbal and written communication skills.

  • Self-motivated.


Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Experience listed below would be obtained through a combination of your schoolwork/classes/research and/or relevant previous job and/or internship experiences. This is an entry level position.

Minimum Qualifications

  • The candidate must possess a Bachelor's or Master's degree in Mechanical Engineering, Material Science or related field.

Preferred qualifications:

  • Hands-on experience with tools in a lab environment.

  • Knowledge of SSD form factors and design.

  • Knowledge of semiconductor packaging technology and solder joint reliability.

  • Knowledge of package and board design software (Cadence Allegro/Mentor); CAD (Solidworks).


Inside this Business Group

Employees in Intel's NVM Solutions Group deliver solutions that are transforming computing across all segments from data centers to Ultrabooks. They invent, develop, bring to market and support customers with leading-edge NAND flash memory and system level solutions such as solid state drives (SSDs). SSDs are accelerating performance for gaming enthusiasts, reducing total cost of ownership for IT managers of data centers and improving security and reliability for businesses. This dynamic group is strategically positioned to become the leading Non-Volatile Memory solution supplier for the compute segment and is a key to expanding markets and continuing the growth for Intel.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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