You will be responsible for process design rule definition, construction and validation of lead certification Tape-in Collaterals for Intel's next generation process technology and products. You will be responsible for the validation and creation of layout that will enable fundamental process development.
Your responsibilities will include but will not be limited to:
Verify layout adherence to complex layout design rules, specifically ownership in Quality Assurance of FRAT designs across all Intel process nodes.
Troubleshoot design and verification issues with complex physical designs flows, both industry standard and Intel tools and flows.
Write software code for cell design and verification including optimizing runtime
Develop utility programs to construct test cases and package design content for distribution
Development and support of LTD Tape-in Collateral Library for ALL Intel Process Technology nodes including CR experimental Path Finding projects.
Collaborating, directing, extracting, executing designs and constructs that will be used for process implementation, monitoring, improvement, and development well ahead of any other team in LTD. This interaction will be with a very diverse team including Litho, Integration, Device, Test Chip, Tape Out, and OPC and RET (Reticle Enhancement Team) experts. These designs will be used during development, refined, and then made available for HVM (High Volume Manufacturing).
The ideal candidate must possess the following behavioral skills:
Attention to details and discipline in following defined methodologies
Communication skills, ability to convey technical content clearly and concisely
Proven track record of results and execution in a tight schedule environment
Tolerance to ambiguity, ability to efficiently define concrete architecture and design strategy/plans
Team player and influence skills
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Bachelor's degree in Electrical Engineering, Computer Engineering or related discipline.
Minimum 3 months of coursework and background should include VLSI design or CAD; programming (e.g. Python, C++); Semiconductor Device Physics or basic electrical circuit theory; Silicon manufacturing flows.
-Minimum of 3 months of experience (from coursework or internship experience) in the following:
Semiconductor processing/engineering or computer science.
Circuit mask design layout and/or verification, including ICV or Calibre experience programming skills in C, Python or SKILL
Analyzing and comprehending semiconductor process flows
Interacting with different modules involved in process development
Basic solid-state physics, optics and process flow
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.