Package Failure Analysis Engineer
In this position, you will be responsible for identifying and researching component failures to improve yield, quality and/or reliability. Your responsibilities will include but not be limited to:
- Knowledge in material analysis techniques such as FTIR, EDX is a must; others such as XPS, Tof-SIMS, Raman Spectroscopy would be added advantage.
- Perform electrical validation and fault isolation to products that failed test and finding the physical defects that associate with the electrical failure. Be able to clearly comment about the failure mode and mechanism.
- Evaluating assembly, fab or substrate processes, material properties and mechanical characteristics of components to determine the root cause of failure.
- Using analytical tools such as Parametric Analyzer (I/V analysis), Keithley meter, TDR, EOTPR, SEM/EDX, FIB, FTIR, X-Ray, Acoustic Imaging, IR Imaging Tool, mechanical & chemical sample preparation and others to understand the failure mode and mechanism.
- Publishing analytical reports with established failure mechanisms, potential root causes and recommending corrective actions to prevent reoccurrence of problems.
- Analyzing failure reports and recommending corrective action to prevent reoccurrence of problems.
- Responsible to remove analytical barriers faced in new package technology and develop analytical techniques and metrologies for Q&R use.
- Supporting new package transfer and responsible to proliferate best known methods and key learning to Assembly Test Manufacturing (ATM) sites.
- Knowledge in analytical tools such as Parametric Analyzer (I/V analysis), Keithley meter, TDR, EOTPR, SEM/EDX, FIB, FTIR, X-Ray, Acoustic Imaging, IR Imaging Tool.
- Strong problem solving and analytical skills.
Inside this Business Group
- Bachelor or a Master of Science degree in Chemistry, Industrial Chemistry Material Science, Chemical Engineering or equivalent experience and/or degree and/or background.
- Knowledge in material analysis methods such as EDX, FTIR, is a must.
- Ability to demonstrate in-depth understanding of analytical equipment and semiconductor process flow operation
- Good team player and be able to establish collaborative relationships with internal customers
- Knowledge of basic statistics would be an added advantage
- Lab experience with Fourier-transform infrared spectroscopy (FTIR) Scanning Electron Microscopy (SEM), Focused Ion Beam (FIB), Electrical Testing and Fault Isolation using Curve Tracer or similar would be highly desired.
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth