Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.
Responsible for the following:
-Thermal/mechanical/electrical design, analysis, and development of electronic packages.
-Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design.
-Conducts tests and research on basic materials and properties.
-Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.
-Provides consultation concerning packaging problems and improvements in the packaging process.
-Responds to customer/client requests or events as they occur.
-Develops solutions to problems utilizing formal education and judgment.
Substrate Packaging Technology Development (SPTD) is looking to hire an engineer to join a team tasked with developing and ramping advanced organic substrate and packaging technologies via an internal pathfinding, technology development, and low volume manufacturing line. As a Packaging Research and Development Engineer in Module Engineering, you will be required to develop material characterization and process technology in the SPTD Front End Lithography Area.
This position will require a significant amount of time spent on the factory floor to develop new process technology and characterization of new materials and chemical processes. Since this will involve startup of new manufacturing capability for Intel, a high tolerance of ambiguity and flexibility with respect to job roles is desired.
The ideal candidate should exhibit the following behavioral traits/skills:
- Solid theoretical and practical understanding in materials characterization.
- Demonstrated listening, written and verbal communication skills to all levels of the organization.
- Demonstrated problem solving and analytical skills.
- Demonstrated capability of working and excelling in a high performing team environment.
This is an entry level position and compensation will be given accordingly.
You must possess the below minimum qualifications to be initially considered for this position.
Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
Knowledge and/or experience listed below would be obtained through a combination of your school work and/or classes and/or research and/or relevant previous job and/or internship experiences .
Must have the required degree or expect the required degree by September 2021.
1+ years of experience in the following:
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.