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Job ID: JR0164154
Job Category: Materials
Primary Location: Penang, PNG MY
Other Locations: Malaysia, Kulim;Vietnam, Ho_Chi_Minh_City
Job Type: Experienced Hire

Memory Supply Chain Engineering Lead

Job Description

This leadership opportunity allows individual to serve as SSC's technical point of contact for memory technology engineering programs running through Intel factories in China, Malaysia and Vietnam. Being at the intersection of TD, Quality and Supplier teams allows the unique opportunity to identify and resolve, highly-visible and mission critical technical challenges.

Responsibilities include but may not be limited to -

Lead memory yield analysis and issue resolution.
Drive memory material readiness and qualification, planning and execution of experiments (Design of Experiments).
Own optimization of supplier high volume activities including process control, change management, manufacturing readiness, yield improvement, excursion root causing and corrective action.
Own risk assessment and risk mitigation plans for Memory components.
Lead Supplier audits and line walks.
Collaborate with memory suppliers to meet quality, reliability, cost, yield and manufacturability requirements.
Continuously improve supply chain costs, process control, production yield, change and excursion management.
Maintain GSC SSC quality standard and systems by aligning operational requirements with supplier capability. Serve as POC for technical escalations arising from factories.


Qualifications

Key discerning attributes of a successful candidate include -

High-level of maturity, resilience and demonstrated ability to steer issues from root-cause through solution implementation.
Ability to apply a strategic mindset to problem solving and build holistic view of technology challenges to drive into broad-based supplier feedback.
Demonstrates in-depth understanding of back-end development and manufacturing processes and leverage their already established network with ATM, ATTD and QnR to drive issues to closure.
Displays understanding of integration challenges related to third-party ("external") silicon into an Intel-product and knowledge of high bandwidth memory technologies.
Demonstrates knowledge related to power, performance and thermal design considerations around high-bandwidth memories (HBM, LPDDR, etc.).

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth



Other Locations

Malaysia, Kulim;Vietnam, Ho_Chi_Minh_City

MYExperienced HireJR0164154
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