Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings.
Intel's unique Optane memory technology delivers industry leading low latency in both solid-state drive and persistent memory products, that are positioned to change how data is managed worldwide. You can learn more about Intel Optane here: https://www.intel.com/content/www/us/en/architecture-and-technology/optane-memory.html
In this position you will be part of Optane Backend BE Manufacturing Operations team of the Intel Optane Group (IOG). As the Product Manufacturing Leader, you will be a key contributor to IOG by delivering robust components and systems, manufacturing operations, and overall readiness for IOG Datacenter Persistent Memory (DCPMM) products from project planning through product end of life.
Our team is responsible for component assembly/test, SSD (solid static disk) and persistent memory module manufacturing capability and stability starting from NPI through HVM until end of life, optimizing for quality, costs, and velocity. The team includes the functions of Product Manufacturing Team Lead, Manufacturing Process Development (also called New Product Introduction), Module and Test Operations and Tools / System and automation development. We are a global organization with the majority team members based in US and others based in Taipei Taiwan and Shanghai China.
We’re searching for a Product Manufacturing Leader that defines the strategy and asks the right questions while leading and delivering SSD product through product release qualification / shipment release authorization (PRQ/SRA). Providing timely care to internal and external stakeholders and enabling factory capability readiness and stability to support product launch till end of life with cost and quality.
The ideal candidate will have the following skills:
Strong program management skills
Self-starter with skills to influence across several organizations.
Excellent written and verbal communications.
You must possess the below education and minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates
Bachelor’s degree in physics, electrical engineering, computer engineering and other related fields.
8+ years of experience in related engineering product development or product manufacturing role.
5+ years of experience in a Technical Project Management role.
6+ years of manufacturing background Supply Chain experience.
Semiconductor Component and SSD Systems manufacturing or relevant product development experience
Chinese language fluency
Outsourced manufacturing experience desired.
The Data Center Group (DCG) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.
US, California, Santa Clara;US, Oregon, Hillsboro
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.