The Intel NVM Non Volatile Memory Process Technology Development group is responsible for developing state of the art NVM memory technologies like 3DNANDnbspThis position is associated with the sale of Intel's NAND memory and storage business to SK hynix
You can read more about the transaction in the press release httpsnewsroomintelcomwpcontentuploadssites11202010nandmemorynewsqapdf
The transaction will enhance the resources and potential of the business storage solutions including client and enterprise SSDs in the rapidly growing NAND Flash space amid the era of big data
This is an exciting time to be at Intel come join our Process Technology Development group as a Tapeout Software Engineer and work on one of the most advanced 3DNAND and SSD technology portfolios in the world.
As the global leader in the semiconductor industry Intel possesses many industry leading SSD technologies including the most capable Quadruple Level Cell QLC NAND Flash products
As a Tapeout Software Engineer you will be part of a world class team that will transition to lead the SSD business at SK hynix
This position aligns to Phase 2 of the transaction which includes NAND technology and component development along with fab operations. Employees aligned to Phase 2 will continue to be employed by Intel and will continue to develop NAND technology and components and manufacture NAND wafers at the fab. Phase 2 of the transaction is expected to close in March 2025 at which time employees aligned to this phase of the transaction will transition employment to SK hynix.
As a Tapeout Software engineer in the NAND Collateral Development group your responsibilities will include
There will also be opportunities to contribute in the areas of Mask Manufacturing process Layout Design and OPC recipe development The ideal candidate will have the following skills
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.