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BSMS degree in electrical electronic engineering with 10 years of relevant experience in High speed board design as an Signal Integrity Engineer is a must. Hands on experience developing server class motherboards based on Intel x86 processor chipsets is desirable. Candidate must demonstrate in depth knowledge of all aspects of commercial HW development including PCB materials, stackup optimizations, HW Verification and testing for SI measurements is required. Hands on experience in using Test Equipment like Scopes, BERT, PCIe/DDR Compliance setups for high speed boards .is desirable. Should have good understanding of electrical, electromagnetic fundamentals Signal/Power Integrity fundamentals. Must have BE / MS in Electrical Engineering or Electronics Engineering with minimum 8+ years' experience with below skill sets: Strong electrical/electromagnetic fundamentals Strong Signal/Power Integrity fundamentals Strong knowledge of Power Delivery Network, impedance profile analysis, including low power methodologies; power delivery modelling and complete system level power delivery modelling. Good system/board design knowledge and process awareness. Good background in High Speed System Interfaces like DDR, PCIe, USB3.0 etc. Good knowledge in 3D/2D EM simulation tools like HFSS/Q3D/ADS/HSpice/PowerDC. Working knowledge of basic electronic equipment including digital oscilloscope, DMM, network analyzer etc. Good communication skills and very good team player.
The Data Center Group (DCG) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.