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Job ID: JR0123672
Job Category: Engineering
Primary Location: Kulim, KDH MY
Other Locations:
Job Type: College Grad

Thermal Compression Bonding (TCB) Module Engineer On Shift

Job Description
In this position, you will be responsible to work in shift structure (Following the shift calendar which include day shift and night shift) to sustain & improve the Thermal Compression Bonding (TCB) Module performance under Assembly Engineering Department in our organization . Your responsibilities will include but not be limited to:
� Continuous improvement on Process and equipment performance to meet Safety, Quality, Productivity and Cost indicators' goal to support Intel products ramp.
� Perform detail data analysis and deep-dive investigation to detect the process shift signal or issue from the tool/incoming factors and capable to find the root cause of the abnormality
� Partner with respective Technology Development counterpart and other factories counterpart to develop, startup, improve and define the critical equipment and process parameters to enable a successful startup and ramp of the factory
� Responsible for Copy Exactly and process control system to ensure high quality and yield performance for the product


Qualifications

Qualifications
� Able to work in shift structure by following the shift calendar include day shift and night shift rotation
� Engineering degree in Mechanical/Mechatronics/Electrical/Robotics/Chemical
� Good interpersonal and communication skills.
� Strong Technical knowledge in statistical process control, commonality analysis, design of experiment, failure modes/effects analysis, ISO quality management are added advantages.
� Fresh graduates are encouraged to apply.
� With Assembly equipment and process knowledge will be an advantages

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

MYCollege GradJR0123672
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