Chip Attach Module (CAM) Module Engineer
In this position, you will be responsible to sustain & improve the process and equipment performance in Chip Attach Module Engineering under Assembly Engineering Department in our organization. Your responsibilities will include but not be limited to:
� Continuous improvement on equipment and process performance to meet Safety, Quality, Productivity and Cost indicators' goal to support Intel products ramp.
� Partner with respective Technology Development counterpart and other factories counterpart to develop, startup, improve and define the critical equipment and process parameters to enable a successful startup and ramp of the factory
� Attend to escalation from Equipment Supervisor / Shift MT and troubleshoot the hard down machines from the area where you are assigned to.
� Perform detail investigation and problem solving data analysis to ensure equipment / tool is up and ready to support production
� Responsible for Copy Exactly and process control system to ensure high quality and yield performance for the product
� Align to product roadmap and build plan requirement, proactively work on tool fungibility qualification across links to support capacity ramp.
Inside this Business Group
� Engineering degree in Mechanical/Mechatronics/Electrical/Robotics/Chemical
� Good interpersonal and communication skills.
� Technical knowledge in statistical process control, commonality analysis, design of experiment, failure modes/effects analysis, ISO quality management are added advantages.
� Fresh graduates are encouraged to apply.
� With Assembly equipment and process knowledge will be an advantages
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth