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Job ID: JR0123551
Job Category: Contract Employee
Primary Location: Phoenix, AZ US
Other Locations:
Job Type: Intel Contract Employee

Packaging R&D Engineer - Temporary Contract

Job Description

The Experimental Mechanics Lab identifies and solves thermo-mechanical issues in the field of electronic packaging.

The lab personnel use a variety of tools to study the behavior of an electronic package and its constituents under different mechanical and/or thermal loading conditions:

  • Like dynamic warpage of package using optics-based tools
  • Adhesion strength characterization of various interfaces in a package using Double Cantilever Beam test
  • Fracture toughness measurement of bulk materials using three-point bend test
  • Coefficient of Thermal Expansion (CTE) measurement using 3D Digital Image Correlation method

A typical job would involve design of experiment, setup definition including fabrication, sample preparation, data collection and analysis, report presentation, and documentation.

  • Lab engineers also help develop new metrologies to close gaps in lab capabilities when it comes to new packaging technologies.

The candidate should also exhibit the following behavioral traits or/and skills:

  • Encourage candidates with Experimental Mechanics background and problem solving skills and ability to multitask to apply to multitask.
  • An ideal candidate would be hands-on and work well in a team.

Temporary Contract: 12 months


This U.S. position is open to U.S. Workers Only.

A U.S. Worker is someone who is either a U.S. Citizen, U.S. National, U.S. Lawful Permanent Resident, or a person granted Refugee or Asylum status by the U.S. Government.

Intel will not sponsor a foreign national for this position.

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Knowledge and/or experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.


  • Possess a bachelor's degree or master's degree in Mechanical Engineering or Materials Science or Engineering or related field with 6 months experience.


6 months of experience in:

  • Material characterization, Data Acquisition Systems (DAQs), basic optics, and/or structural health monitoring.

  • LabView and Matlab programming.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....

USIntel Contract EmployeeJR0123551
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