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Job ID: JR0123183
Job Category: Intern/Student
Primary Location: Kulim, KDH MY
Other Locations:
Job Type: Intern

Intern - Mechanical Engineering

Job Description

The candidate will be assisting in developing structural, thermal and fluid dynamic simulation and experiment methodology for supporting future electronic packaging research and development needs.

The range of project can span from but not limited to packaging design optimization for warpage and reliability, solder joint reliability assessment, thermal process modelling, underfill or mold flow modelling, fracture simulation and corresponding experimental validation.

All these will be used for enhancing the quality and reliability of the product under development. The work progress will be paced and tracked based on agreeable deliverables with the supervisor.


  • Pursuing a Bachelor/Master degree in Mechanical Engineering and familiar in either Finite Element Analysis (FEA) and Computational Fluid Dynamic (CFD).
  • Candidate is able to conduct lab experimental and design work (CAD).
  • Exhibits strong fundamental in solid mechanics, fluid dynamics and heat transfer.
  • Candidate with basic level of programming knowledge would be an added advantage.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

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