The candidate will be involved in developing structural, thermal and fluid dynamic simulation and experiment methodology for supporting future electronic packaging research and development needs.
The range of research and development can span from but not limited to packaging design optimization for warpage and reliability, solder joint reliability assessment, thermal process modelling, underfill or mold flow modelling, fracture simulation and corresponding experimental validation.
All these will be used for enhancing the quality and reliability of the product under development. The work progress will be paced and tracked based on agreeable deliverables with the supervisor.
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth