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Job ID: JR0122942
Job Category: Intern/Student
Primary Location: Phoenix, AZ US
Other Locations:
Job Type: Intern

Thermal Engineer Intern

Job Description

Intel's Thermal/Fluid Core Competency (TFCC) group seeks a thermal engineer intern.

The successful candidate for this position will participate in the thermal modeling and characterization of microprocessor packages and the related thermal systems.

The scope will include 3D thermal and CFD modeling using commercially available tools like Ansys Fluent and/or Icepak, and Flotherm, and experimental data collections.

The candidate will also be responsible for conducting tests and research on basic materials and properties.


  • Build package and system thermal models;
  • Design fixtures and tooling to support lab test setup;
  • Design experiments and proof-of-concept tests
  • Conduct experiments and collect data;
  • Analyze and report the test data and modeling results

The ideal candidate should exhibit the following behavioral traits/skills:

  • Documentation/writing skills
  • Ability to work with cross-functional teams
  • Design, organizational, multi-tasking and self-direction skills

This is an entry level position and will be compensated accordingly.


You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Knowledge and/or experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.


  • Pursuing a master's degree or PhD degree in Mechanical Engineering or related field
  • 6 months of numerical or experimental research in thermals or related field


  • Exposure to computational fluid dynamics (CFD) numerical techniques for thermal modeling and simulation such as finite volume/difference/element approaches.
  • Hands-on measurements expertise required in the thermal and/or fluid flow analysis of IC packaging.
  • Working knowledge of lab data collection tools like LabVIEW.
  • Exposure to commercial software such as ANSYS FLUENT, FLOWTHERM, COMSOL and/or ICEPAK.
  • Familiarity with the CAD software such as Solidworks and PRO-E
  • Industry experience in design and high volume manufacturing.
  • Familiarity with packaging assembly processes and failure analysis.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....

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