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Job ID: JR0122941
Job Category: Intern/Student
Primary Location: Phoenix, AZ US
Other Locations:
Job Type: Intern

Thermal Engineer Undergrad Intern

Job Description

Intel's Thermal/Fluid Core Competency (TFCC) group seeks a thermal engineer intern.

The successful candidate for this position will participate in the development of scripts that automate common thermal simulations.

Through the candidate's understanding of fundamental thermal processes and experience in MATLAB and Python languages, they will create efficient, innovative modeling systems.


  • Write MATLAB scripts and generate MATLAB GUIs to automate thermal simulations
  • Validate tools against known simulation results
  • Design and enact tests to assess automation effectiveness and efficiency
  • Create presentations that concisely describe ideas, implementation, and results

The ideal candidate should exhibit the following behavioral traits/skills:

  • Documentation/writing skills
  • Ability to work with cross-functional teams
  • Design, organizational, multi-tasking and self-direction skills

This is an entry level position and will be compensated accordingly.


This U.S. position is open to U.S. Workers Only.

A U.S. Worker is someone who is either a U.S. Citizen, U.S. National, U.S. Lawful Permanent Resident, or a person granted Refugee or Asylum status by the U.S. Government.

Intel will not sponsor a foreign national for this position.

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

3 months knowledge and/or experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.


  • Current undergraduate student in mechanical engineering (or related field)
  • Experience with MATLAB programming, including knowledge of GUIs using MATLAB App Designer
  • Experience with Python programming
  • Completed coursework on at least one heat transfer class


  • Junior or senior in undergraduate program
  • Completed coursework on finite element / finite difference analysis techniques
  • Exposure to commercial software such as ANSYS FLUENT, FLOWTHERM, COMSOL and/or ICEPAK.
  • Experience with high-performance computing environments
  • Familiarity with electronics packaging fundamentals, including thermal and fluid considerations

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....

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