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Job ID: JR0122662
Job Category: Engineering
Primary Location: Penang, PNG MY
Other Locations:
Job Type: College Grad

Failure Analysis R&D Engineer

Job Description

In this position, you will be performing failure analysis and root cause analysis on Intel CPU, Chipsets and Netcomm platform products. This includes PC system and/or tester testing and analysis to isolate the failing instruction and internal signal, applying circuit analysis and various device localization equipment and techniques to localize the failing circuitries and performing physical failure analysis to locate the defect. Your responsibilities will include but not be limited to:

  • Responsible for improving product yield, quality and reliability through the recommendation of corrective actions to counterparts in Fab and Assembly and Test for root cause fix.
  • Participating in new product and/or technology transfer and startup, enabling automation and improvement on the failure analysis process, tools and methodology, developing new FA techniques and proliferating learning across sites.


Qualifications

You must possess a Master's or a Bachelor's degree in Electrical, Electronics, or Microelectronics. Additional qualifications include:

Excellent verbal and written communication skills.

Ability to work well in a diverse team environment.

Good knowledge in one or more of these areas would be an added advantage:

  • Device physics.
  • I/O structure.
  • Microprocessor architecture and micro architecture, microprocessor circuit, assembly language and IA-32.
  • Wireless communication.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

MYCollege GradJR0122662
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