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Job ID: JR0122462
Job Category: Engineering
Primary Location: Penang, PNG MY
Other Locations: Malaysia, Kulim
Job Type: College Grad

Package Design Engineer

Job Description

The candidate will be responsible to design Intel's substrate packages for products, test chips and test probes using latest state of the art package technology developed by Intel's Assembly Test Technology Development (ATTD) group. He/she will work closely with internal stakeholders including external customers at times to define the package requirement and overall design schedule. He/she will own the design activities including layout, electrical and design process to ensure the success in package tape-out to meet the quality and schedule.


Qualifications

Bachelors/Masters in Electrical or Electronics or Mechatronics Engineering.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth



Other Locations

Malaysia, Kulim

MYCollege GradJR0122462
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