Microelectronic Packaging Research and Development (R&D) Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor processes.
Responsibilities may be quite diverse of a technical nature. U.S. experience and education requirements will vary significantly depending on the unique needs of the job.
Job assignments are usually for the summer or for short periods during breaks from school.
Responsibilities will include, but not be limited to:
This is an entry level position and compensation will be given accordingly.
The ideal candidate should exhibit the following behavioral traits/skills:
You must possess the below minimum qualifications to be initially considered for this intern position.
Knowledge and/or experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....