Mechanical Core Competency Lab Intern
Internship with Intel's Mechanical Core Competency laboratory located in Hillsboro, Oregon.
- You will be responsible for developing metrologies and mechanical testing of materials and components to support new packaging technologies.
- You will proactively use available resources to research and to conduct experiments.
- Documentation and presentation of results and progress are expected.
- Routine work includes formulating sound experiment or test strategies, troubleshooting metrologies and methodologies, designing and integrating appropriate hardware/software, and documenting/presenting results.
- Additional responsibilities include applying and utilizing existing metrologies to new problems and developing new custom metrologies or testing apparatus for situations where commercial tools do not exist.
The successful candidate will possess the following characteristics:
- Self-motivation and pro-activeness to overcome challenges.
- High degree of intellectual curiosity and willingness to attempt new solutions.
- Self-accountability to apply necessary technical rigor to own work.
- Diligence in documenting work and results.
You are expected to observe all safety procedures and ISO requirements.
This is an entry level position and will be compensated accordingly.
You must possess the below minimum qualifications to be initially considered for this position.
Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Knowledge and/or experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
- Must be enrolled and pursuing a PhD or ScD degree in Materials Science/Engineering, Mechanical Engineering, or Physics.
- Currently in the 2nd or 3rd year of a doctorate level program, with graduation in 2021 or 2022.
- 3.00 GPA or higher.
- Background in non-contact optical metrologies.
- 12 months hand-on experience with elevated temperature, non-contact topography and deformation characterization techniques such as, but not limited to, moiré, interferometry, and digital image correlation.
- 6 months hands-on experience with mechanical testing instruments (MTS, Instron, or equivalent) and fixture development for mechanical testing.
Inside this Business Group
- 6 months hands-on experience with mechanical testing instruments (MTS, Instron, or equivalent) and fixture development for mechanical testing. Independent work.
- 1+ year hands on experience with mechanical testing of materials.
- Knowledge in use of force, displacement, pressure, and strain transducers.
- Knowledge in use of hydraulic, pneumatic, mechanical, electrical, and piezoelectric actuators.
- Experience in design and creation of test fixtures. Proficiency in Solidworks.
- Experience with metrology equipment development and integration.
- Experience with MEMS testing.
- Knowledge of statistical concepts and design of experiment concepts.
- Knowledge of Matlab / LabView programming.
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....