Come join a dynamic and ever challenging team focused on the development of Intel's line of 3D NAND technology.
As part of the broader NAND Product Engineer department, you will be responsible for developing the software tools to enable characterizing the health of NAND flash wafers and components in terms of performance, cycling, and temperature. The team utilizes Nextest Magnum Platform (C++/APG) for NAND product characterization. The focus of this team within PE is to deliver a product that meets RBER qualification specifications (tPROG/tBERS/tR) across all cycle counts and usage conditions. In this role, you will be expected to autonomously plan and schedule daily tasks; and develop solutions to problems leveraging your formal education and engineering judgment.
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....