Intel is looking for highly motivated individuals with strong technical background and capabilities to sustain, ramp, and transfer 14nm and beyond technologies using state of the art equipment and materials. They will drive rapid continuous improvements in safety, quality, yield, reliability, cost, process stability/capability, and productivity while maintaining rigorous CE! (Copy exactly) and best tool matching within the Intel factory network. The Yield Engineer will provide process introduction, enhancement and sustaining support for Intel on 14 nm and the wider Intel fab network. Manage process performance, specifications and technology certification requirements. Provide solutions to problems and improvements in the wafer fabrication process. Develop solutions to problems by utilizing experience, formal education and judgment.
The ideal candidate will exhibit the following behavioral traits:
- Problem solving
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
- The candidate must possess a Bachelors, Masters or PhD in Chemical Engineering, Electrical Engineering, Material Science, Microelectronics Engineering, Mechanical Engineering, Optical Engineering, Chemistry or Physics.
- At the Bachelors level the candidate must possess the unrestricted right to work in the US. This U.S. position is open to U.S. Workers Only. A U.S. Worker is someone who is either a U.S. Citizen, U.S. National, U.S. Lawful Permanent Resident, or a person granted Refugee or Asylum status by the U.S. Government. Intel will not sponsor a foreign national for this position.
Minimum of :
- 1+ years of experience on Semiconductors and Yield Analysis tools. (techniques and systems)
- Physics of Semiconductor Materials, Semiconductor circuits and devices, properties of materials
- Wafer fabrication
- Materials Analysis techniques such as SEM, TEM, EDX, SIMS, XPS, XRD, FTIR or Auger
- Statistical Process Control
- Design of experiments (DOE) principles.
- Data analysis. (examples include: JMP, SPC, MatLab, Mathematic)
- Processing techniques (Litho, Etch, Implant, CMP, CVD, plating, diffusion, thin films, etc)
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....