Responsible for identifying failures and researching process/Product improvements to enhance yield, performance, quality and reliability of next generation Si, Product and Package technologies. Investigates and thoroughly explains fundamental aspects of material/device interactions. Owns the development of electrical, analytical and mechanical methodologies to ensure strategic failure analysis capabilities for future technologies and products. Directs new technology/product transfer, manufacturing startup, and the automation and improvement of the failure analysis process. Owns proliferation of shared learning across sites. Maintains necessary records and reports. Performs other related duties as required or as directed.
Also, responsible for research and development of Fault isolation tools and solutions to debug Intel microprocessors and/or chipset in order to improve yield, quality and reliability.
The ideal candidate should exhibit the ideal behavioral traits:
This an entry level position and will be compensated accordingly.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
- Device physics , semiconductor package/product fabrication and electrical characterization.
- Programming and scripting languages like: Perl, Shell, Python, R or TCL and MatLab.Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....