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Job ID: JR0092075
Job Category: Engineering
Primary Location: Hillsboro, OR US
Other Locations:
Job Type: College Grad

Process TD Engineer

Job Description

Intel's assembly technology development team is looking for engineers to develop innovative motherboard assembly and inspection solutions to prepare customers for the production of Intel's next generation product lines.

The role entails process and equipment development to 1) certify Intel next gen packaging solutions and 2) assemble prototypes of next generation Intel products.  Defines and establishes flow, procedures, and equipment configuration for the printed circuit board assembly manufacturing module. Selects and develops material, tooling, fixtures, and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Works with product engineers and the new package platform owners to plan and conduct experiments to fully characterize the process throughout the development cycle.  Drives improvements on yield, process stability/capability, productivity and safety/ergonomic over variables such as material, method, equipment, environment and operating personnel. Develops solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools. Establishes process control systems such as SPC methods for the manufacturing module.  Trains production and partner site process engineers for transfer to other factories.

The ideal candidate should exhibit the following behavioral traits:

- Problem solving and detail orientation skills.

- Ability to work across multi culture and/or multi geography teams.

-Technical leadership

- Communication skills


You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through school work, classes and project work, internships, military training, and/or work experience.

  • This is an entry level position and compensation will be given accordingly.
  • Candidate must possess a Master's or PhD degree in Mechanical Engineering, Material Science.
  • Minimum of 1 year of experience in manufacturing and/or circuit board assembling technology development (TD)
  • Minimum of 1 year of experience with  surface mount technologies to assemble printed circuit boards, which utilizes processes related to solder paste screen printing, component placement, SMT reflow, wave solder and test. 
  • Minimum of 1 year of experience with FMEA, SPC, statistical methods, and data analysis methods.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....

USCollege GradJR0092075
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