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Job ID: JR0089503
Job Category: Intern/Student
Primary Location: Santa Clara, CA US
Other Locations: US, Arizona, Phoenix;US, Oregon, Hillsboro
Job Type: Intern

Si Packaging Engineer Intern

Job Description

As Package design Intern, you will be exposed to various aspects of PKG designs across Intel's Server product portfolios (CPUs, Chipsets, SOC designs and more). You will be trained to support technical design process like conducting early route studies, tracking specifications, supporting collaterals for electrical analysis and shadowing Sr. Lead Packaging Engineers and Designers on production layouts. Job function also involves performing various supporting functions like maintaining design schedules, understanding aspects of physical design and eventually be able to guide package tape out process. Internship will also allow opportunities to work closely/get exposed to other stakeholders from different organizations within the company to incorporate their inputs into the PKG design.

You should also exhibit the following behaviors skills:

  • Proven Team player
  • Communication and stakeholder management skills


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

  • Enrolled in Master's Program in Electrical, Mechanical/Thermal Engineering, Materials Science or related disciplines
  • Prior experience/exposure with physical design (Package/PCB) is preferred

Additional Preferred Qualifications:

  • Exposure in Package/Substrate technology development
  • Familiarity with PKG design tools like Auto CAD, Cadence and/or Mentor Graphics
  • Familiarity with Package layout extraction and Electrical modeling/simulation tools such as PowerDC, Hyperlynx, Q3D, and HFSS
  • Interest in scripting languages such as Perl, VB

Inside this Business Group

The Data Center Group (DCG) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.



Other Locations

US, Arizona, Phoenix;US, Oregon, Hillsboro



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....

USInternJR0089503
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