Apply Now    
Job ID: JR0049876
Job Category: Engineering Support
Primary Location: Phoenix, AZ US
Other Locations: US, Oregon, Hillsboro;
Job Type:

Technology Development Engineer

Job Description

Defines roadmaps to meet requirements, goals and milestones for a new technology process. Defines and establishes flow, procedures, and equipment configuration for the module. Selects and develops material and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Plans and conducts experiments to fully characterize the process throughout the development cycle. Drives improvements on quality, reliability, cost, yield, process stability/capability, productivity and safety/ergonomic over variables such as material, method, equipment, environment and operating personnel. Develops solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools. Establishes process control systems for the process module and sustains the module through volume ramp. Develops strategy to resolve difficult problems and establishes systems to deal with these problems in the future. Trains production/receiving process engineers for transfer to other factories. Transfers process to high volume manufacturing and provide support in new factory start-up as well as install and qualification of the new production lines.

This is an entry level position and will be compensated accordingly.

The ideal candidate should exhibit the following behavioral traits:

  • Strong verbal and written communication.
  • Demonstrated leadership.
  • Willingness to embrace ambiguity.
  • Strong analytical and problem solving skills.
  • Ability to prioritize objectives and plans and execute.
  • Ability to inspire and engage employees.
  • Strong collaboration and teamwork skills,

This US based position does not experience a shortage of qualified U.S. Workers.  Intel limits its sponsorship of individuals possessing temporary work authorization or requiring a visa to those positions for which we experience a shortage of qualified and available U.S. Workers. A U.S. Worker is someone who is either a US Citizen, U.S. National, U.S. Lawful Permanent Resident, or a person granted Refugee or Asylum status by the U.S. Government.


You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences. 

Minimum Qualifications: 

  • Possess a  B. S., M.S. or Ph.D. degree in Statistics, Mechanical Engineering, Materials Engineering, Chemical Engineering, Polymer Engineering, Inorganic Chemistry, Material Technology (Polymers), Nanotechnology, Mathematics / Applied Physics, Systems Engineering, Computer Engineering, Industrial Engineering or Computer Science.
  • When the scope of the job and position requires to work on a compressed work week schedule you must have the ability to work on this type of Shift. Shifts are twelve hours long and rotate from three to four days a week. There are four shifts which include: Sunday/Monday/Tuesday every other Wednesday days (Shift 5); Thursday/Friday/Saturday every other Wednesday days (Shift 7); Sunday/Monday/Tuesday every other Saturday nights (Shift 4); and Wednesday/Thursday/Friday every other Saturday nights (Shift 6).

Preferred Qualifications:

  • Prior industry internship experience is strongly preferred.
  • Focus on fundamental understanding of semiconductor/silicon processing (lithography, plasma etch, plasma deposition, electroplating and associated interactions).
  • Knowledge of semiconductor materials characterization techniques such as CSAM, X-RAY, XPS, FTIR, SEM/EDX, TEM, TGA, DMA, Raman and other mechanical/electrical/chemical analysis techniques
  • Understanding of reliability failure modes and models in semiconductor processing and electronic packaging. 
  • Familiarity with Assembly (Electronic Packaging) and substrate manufacturing technologies. 
  • Knowledge of statistics and use of statistical tools/methods.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

Other Locations
US, Oregon, Hillsboro;

Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.

Apply Now    

What would you like to do now?

Connect with Us

Get Job Alerts

Get started
Student Center

Find out more about working at Intel

Learn more
Hiring Process

Hiring Process

Learn more

Grow your network of opportunities