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Job ID: JR0049872
Job Category: Engineering
Primary Location: Phoenix, AZ US
Other Locations:
Job Type:

Packaging R&D Engineer

Job Description

Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages. Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design. Conducts tests and research on basic materials and properties. Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance. Provides consultation concerning packaging problems and improvements in the packaging process. Responds to customer/client requests or events as they occur. Develops solutions to problems utilizing formal education and judgment.

This is an entry level position and will be compensated accordingly.

The ideal candidate should exhibit the following behavioral traits:

  • Strong problem-solving, analytical and troubleshooting abilities.
  • Good written and oral communication skills


You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

  • Posses a MS or PhD in Organic Chemistry, Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Polymer Engineering, or other applied engineering degree.
  • Have 6+ months of work or educational experience in the following:

- Developing new processes through hardware and software development as well as chemistry modification.

- Strong understanding of chemical mechanisms in order to achieve tighter tolerances required for next generation packages.

- Experience in troubleshooting integrated issues and working with a broad team of other process and integration engineers.

- Experience in development/industrial tools in the IC, packaging or PCB industry.

Preferred Qualifications:

  • Experience with electrodeposition, electroless deposition, electrochemistry, materials science, organic chemistry, organic composites and/or polymer chemistry/physics.
  • Detailed knowledge of some or all of the following is highly desirable: optical microscopy, electron microscopy (SEM, FIB, TEM, & EBSD), analytical techniques (FTIR, Raman, TGA, DSC), Surface analysis (XPS, TOF-SIMS), EDS, AFM, XRD, mechanical cross-sections, electrical test tools, electrical debug and analyses, and other package-level FA techniques.
  • Experience with statistical data analysis, JMP and JSL, Python, relational database structure and usage, machine learning

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.
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