Job Description As a Materials Analysis Engineer, you will be part of Technology Development Labs responsible for identifying and developing materials characterization and failure analysis techniques in support of Intel's next generation silicon process development. The candidate must work in concert with Process Development and Quality & Reliability Engineers to enable robust failure rate models and risk assessments of the silicon processes under development to improve process performance, product yield, quality and/or reliability. The scope may include wafer and unit level Front-end Module, Back-End/Far Back-End Modules. Your responsibilities will include but are not limited to: Implementing materials characterization techniques to determine fundamental thin film material structure/properties and to collaborate with process development engineers to apply the learning to improve process performance and reliability. Analyzing failure reports and recommending corrective action to prevent reoccurrence of problems. Supporting new process/product transfer and startup and the automation and improvement of the failure analysis process. Ensuring that materials/failure analysis capabilities needed to support advanced process technology and/or product development are in place. May necessitate the development of improved/new tools and methods.
Minimum Qualifications:Ph.D. degree in Physics, Materials Science, Chemistry or Chemical Engineering. Minimum 2 year hands on experience in materials analysis using equipment such as Cameca 6f/7f SIMS, TOFSIMS, and NanoSIMS. Experience in one or more of the following areas: Deposition and characterization of semiconductor materials, device physics, and interconnect reliability, Preferred Qualifications: Prior Intel Intern or Scholarship recipient.Knowledge of semiconductor fabrication, test and/or assembly packaging processing and associated materials.Experience in surface analysis and UHV systems.