Test Process Engineer is responsible for design, development, qualification and validation of the Test Process for assembled packaged semiconductor chips.
This includes the equipment handler and tester hardware/software. Other areas of responsibilities include technology path-finding, architecture development, design material gathering, development of test strategy, determining test parameters, specifying tests to be performed, conducting design reviews, designing and debugging test fixtures, resolving design and implementation issues, performing testability and fault coverage analysis, and meeting production quality and reliability requirements throughout the product life cycle.
Inside this Business Group
Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Additional qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- Posses MS in Electrical Engineering/Computer Engineering/Mechanical Engineering and over 5 years of direct experience in Assembly/Test technology process development or equivalent in the following areas:
• Direct experience in process and equipment development methodology, statistical characterizations, high volume manufacturing readiness, and process control systems.
• Experience with software tools.
• Experience with outsourced semiconductor assembly and Test OSAT environment.
• Business savvy strategic planning cost/financial ROI assessment.
• Proven technical problem solving skills and effective communications skills.
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth