Business Group:As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly packaging. Employees in the Technology and Manufacturing group are part of a worldwide network of manufacturing and assembly/test facilities.Job Description: Microelectronic Packaging Engineers provide project management, Si ATC design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. Responsible for studying silicon and package thermo-mechanical interaction to support Intel's product development as part of the Assembly and Test Technology Development group. The job scope includes design of assembly test chips, validation and data analysis to understand the packaging effect to test vehicle and product performance, yield and reliability. Si Process and Design team works on developing new packaging solutions for Intel products and is responsible for studying silicon device and package thermo-mechanical interactions using assembly test chips. Si Process and Design group works on insuring that all Si - Package interaction issues are understood and DRs are in place to mitigate assembly risk to Si. Provides consultation concerning packaging problems and improvements in the packaging process. Responds to customer/client requests or events as they occur.Job Responsibilities:Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. In this job, you will be responsible for the thermal/mechanical design, analysis, and development of electronic packages. Candidate may be responsible for developing novel thermal solutions for meeting thermal demands across all market segments ranging from hand held devices with constrained physical and thermal environments to higher power server products. Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design. Conducts tests and research on basic materials and properties. Provides consultation concerning packaging problems and improvements in the packaging process. Responds to customer/client requests or events as they occur. As part of the job function, you will also be expected to work in a team environment and interact with other engineers across different sites/countries to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development.
Inside this Business Group
The candidate must possess a MS or PhD in Mechanical Engineering or a related field. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences. Candidate must have 6 + months of work or educational background in the following: Computational fluid dynamics CFD numerical techniques for thermal modeling and simulation such as finite volume/difference/element approaches and/or Modeling and analysis of mechanical components and assemblies Familiarity with Solid Mechanics and CAD software such as Solidworks and PRO-E. Exposure to commercial software such as ABAQUS, ANSYS FLUENT, FLOTHERM, COMSOL and/or ICEPAK. Hands-on measurements expertise in the thermal and/or fluid flow analysis of IC packaging.
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth