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Job ID: JR0009910
Job Category: Engineering
Primary Location: Bangalore, KA IN
Other Locations:
Job Type: Experienced Hire

IC Package Design Engineer

Job Description
Job Description: The engineer is responsible for the physical design of high density package substrates for Intel Microprocessors and Chipsets. The engineer must have a good understanding of flip chip interconnect based leading edge substrate design rules and package assembly driven constraints and rules. The role requires the engineer to collaborate and work with highly multi-disciplined teams spread across different geos, in a fast-paced environment, from path finding phase to the package substrate tape out.Must have experience in delivering high-speed PCBs or high density flip chip interconnect based package designs, using Mentor Xpedition for physical design and tape out. The responsibilities include:-Working with Senior Package Design engineers in driving development of optimal bump patterns for all the IOs/Power rails, meeting the electrical/performance requirements, substrate and assembly design rules, and cost targets. -Support the development of pin map/ball map, in collaboration with the Senior Package Design, System Hardware, Power Integrity, and Signal Integrity engineers. -Owning the route and fit studies, during the early phase of package definition. -Planning and executing the package substrate design activities, meeting the schedule and quality expectations, throughout the development process cycle. -Validating the design using design validation tools. -Driving design reviews with internal stakeholders and with the package substrate manufacturing vendors. -Identifying areas for improvement - for ex: design tool features, design efficiency, and design methods.


Qualification: Experience/Competencies:-5+ years of experience in the development of competitive Packages for high speed products like CPUs/ASICs/Chipsets at least, 2-3 years in driving to completion of package substrate designs with flip chip interconnects. Candidates with strong PCB physical design experience will also be considered. -Good understanding of package substrate design and package assembly rules, would be advantageous.-Exposure to different Package technologies, an advantage. -Proven stakeholder management skills, in a global set-up, with technical teams spread across different geos. -Must be highly motivated, self-directed, and should be able to work effectively, both independently and with other team members.-Ability to drive decision making in a dynamic, cross-functional, and team-oriented environment Education: Bachelor's or Associate degree in an engineering discipline with 5+ years of experience.

Inside this Business Group

The Client Computing Group is responsible for all aspects of the client computing business across Phone, Phablet, Tablet and PC platforms, leading Intel's efforts to transform client computing through technologies, new form factors, and driving Intel's corporate-wide user experience initiatives. This spans all client device brands including hardware, software and connectivity ingredients for phones, tablets, Ultrabook™, All-in-Ones, 2 in 1 computing devices, and home gateways.

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