Inside this Business Group
Qualification: Experience/Competencies:-5+ years of experience in the development of competitive Packages for high speed products like CPUs/ASICs/Chipsets at least, 2-3 years in driving to completion of package substrate designs with flip chip interconnects. Candidates with strong PCB physical design experience will also be considered. -Good understanding of package substrate design and package assembly rules, would be advantageous.-Exposure to different Package technologies, an advantage. -Proven stakeholder management skills, in a global set-up, with technical teams spread across different geos. -Must be highly motivated, self-directed, and should be able to work effectively, both independently and with other team members.-Ability to drive decision making in a dynamic, cross-functional, and team-oriented environment Education: Bachelor's or Associate degree in an engineering discipline with 5+ years of experience.
The Client Computing Group is responsible for all aspects of the client computing business across Phone, Phablet, Tablet and PC platforms, leading Intel's efforts to transform client computing through technologies, new form factors, and driving Intel's corporate-wide user experience initiatives. This spans all client device brands including hardware, software and connectivity ingredients for phones, tablets, Ultrabook™, All-in-Ones, 2 in 1 computing devices, and home gateways.