Biz Group Overview:As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly packaging. Employees in the Technology and Manufacturing group are part of a worldwide network of manufacturing and assembly/test facilities.Job Description: Microelectronic Packaging Engineers provide project management, Si ATC design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. Responsible for studying silicon and package thermo-mechanical interaction to support Intel's product development as part of the Assembly and Test Technology Development group. The job scope includes design of assembly test chips, validation and data analysis to understand the packaging effect to test vehicle and product performance, yield and reliability. Si Process and Design team works on developing new packaging solutions for Intel products and is responsible for studying silicon device and package thermo-mechanical interactions using assembly test chips. Si Process and Design group works on insuring that all Si - Package interaction issues are understood and DRs are in place to mitigate assembly risk to Si. Provides consultation concerning packaging problems and improvements in the packaging process. Responds to customer/client requests or events as they occur.Job Responsibilities: The application engineer will support internal and external customers on package design flows and package design tools. Application Engineer works with design teams to develop requirements and support deployment of internal developed design tools and design automation flows within Mentor Graphics Expedition software environment for physical package layout, connectivity management, and design verification. They work with external suppliers on strategic areas for emerging technologies, to improve design productivity, and improve design validation coverage to support Intel's package roadmap. Application Engineer also perform Validation of tool releases and support tool deployment to package design community. Application Engineer will also work closely with design teams to provide tool training and provide design process solutions.
Inside this Business Group
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.Minimum Qualifications:The candidate must possess a B.S or M.S degree in Computer Engineering, Mechanical Engineering and or Electrical Engineering.Candidate must have 6 + months of work or educational experience in the following:CAD tools like Mentor Expedition/Cadence APD/Allegro.Excellent written and verbal communication skillsAble to work within a teamPreferred Qualifications:Working knowledge with Expedition Design tools,Familiar with Wirebond/FlipChip/Waferlevel packaging technologiesAble to develop scripts in VB, C++, Tcl
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth