The Components Research group delivers innovative semiconductor and packaging technologies research and development. The group focuses on unique, enabling capabilities across all aspects of Intel's semiconductor processing roadmap. Components Research engineers are responsible for leading programs to design, fabricate and analyze novel devices/interconnects/patterning, materials and integration schemes across a wide variety of novel applications.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
You must possess a minimum of a Ph.D. degree majoring in Electrical Engineering, Material Science, Applied Physics, Chemistry or Chemical Engineering or related field
Additional qualifications include:
- Multiple first author publications in refereed journals exhibiting keen experimental insight, meticulous analyses and novel thought.
- Demonstrated hands-on, experimental approach to identifying and solving complex technical problems.
- Expertise in novel device/interconnect design, unique material fabrication or creative testing methodologies.
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth