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Job ID: JR0007946
Job Category: Contract Employee
Primary Location: Penang, PNG MY
Other Locations:
Job Type: Intel Contract Employee

Package Failure Analysis Technician

Job Description
  • Responsible for identifying and researching component failures to improve yield, quality and/or reliability.
  • Perform electrical validation and fault isolation to products that failed test and finding the physical defects that associate with the electrical failure.
  • Able to clearly comment about the failure mode and mechanism.
  • Use sample preparation tools such as Mechanical Polisher, DNC miller, Chemical Etching to reveal the defect or failure.


• Diploma in Materials, Mechanical, or Electrical and Electronic Engineering, Physics or equivalent.
• Proficient in using analytical tools such as Parametric Analyzer I/V analysis, Keithley meter, LCCT, TDR, EOTPR, Acoustic Scanner, X-Ray, FIB, FTIR and others.
• Very dedicated and highly productive person who able to deliver FA result to customers within very challenging timeline.
• Have positive attitude, disciplined and be able to work in shift, and in stressful or highly competitive environment.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

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