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Job ID: JR0006029
Job Category: Intern/Student
Primary Location: Phoenix, AZ US
Other Locations:
Job Type: Intern

SPTD PF Graduate Intern

Job Description
Job Description: We are seeking an engineering R&D intern for 3 months during the summer of 2017. In this role, you will work in the Pathfinding Team on the next generation electronic packaging. Identifying robust & reliable organic material solutions to support high-speed signal transfer for Servers, Cloud applications, 5G is the goal of your project. Specifically, you will identify, characterize and recommend a solution to improve interfacial adhesion between organic dielectric materials and conductor Cu. Your responsibilities may include but are not limited to: - Paper study to identify possible adhesion enhancement solutions between organic dielectric materials & Cu - Understanding the mechanism of the various solutions- Devise & execute experiments to characterize the adhesion promoters with an intent to identify leading solutions


Qualifications:You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements considered in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences. Minimum Qualifications: - Must be pursuing an MS or PhD in Chemical Engineering / Materials Science and Engineering / Chemistry with strong understanding of interfacial properties: chemical mechanisms in order to achieve good adhesion at interface.- Strong problem-solving, analytical and troubleshooting abilities and communication skills. Preferred Qualifications: Detailed knowledge of some or all of the following is highly desirable: optical microscopy, electron microscopy SEM, FIB, & EBSD, surface analysis XPS, TOF-SIMS, EDS, AFM, XRD, mechanical cross-sections.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.
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