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Job ID: JR0004516
Job Category: Engineering
Primary Location: Bangalore, KA IN
Other Locations:
Job Type: Experienced Hire

3G Firmware Senior Engineer

Job Description
10-15 years of experience Bachelors/Masters degree in Communications/Electronics/Computer Science Good knowledge in Wireless Communications Fundamentals Excellent Programming, Design & Coding Skills in C using complex data structure Firmware design & implementation of UMTS/3G/WCDMA/HSDPA/HSUPA /HSPA+ systems Proven experience in implementing Firmware for 3GPP Standards, SW/FW design for embedded real-time systems Experience in ARM low level embedded software programming including HW configuration, state machine design with timing constraints Experience in FW design including external and internal FW interfaces for functional as well as timing aspects 3G Protocol Stack Layer1, Layer2 RLC/MAC, Layer3RRC experience would be a plus Excellent system Debugging skills from device traces Keyword: Firmware, Layer1, 3GPP, Wireless, UMTS, 3G, WCDMA, HSDPA, HSUPA, HSPA, C, 3G Protocol Stack RRC/RLC/MAC, RTOS, Embedded


Qualifications

10-15 years of experience Bachelors/Masters degree in Communications/Electronics/Computer Science Good knowledge in Wireless Communications Fundamentals Excellent Programming, Design & Coding Skills in C using complex data structure Firmware design & implementation of UMTS/3G/WCDMA/HSDPA/HSUPA /HSPA+ systems Proven experience in implementing Firmware for 3GPP Standards, SW/FW design for embedded real-time systems Experience in ARM low level embedded software programming including HW configuration, state machine design with timing constraints Experience in FW design including external and internal FW interfaces for functional as well as timing aspects 3G Protocol Stack Layer1, Layer2 RLC/MAC, Layer3RRC experience would be a plus Excellent system Debugging skills from device traces Keyword: Firmware, Layer1, 3GPP, Wireless, UMTS, 3G, WCDMA, HSDPA, HSUPA, HSPA, C, 3G Protocol Stack RRC/RLC/MAC, RTOS, Embedded

Inside this Business Group

The Platform Engineering Group (PEG) is responsible for the design, development, and production of system-on-a-chip (SoC) products that go into Intel’s next generation client and mobile platforms. PEG strives to lead the industry moving forward through product innovation and world class engineering.

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