Senior Wet Etch Equipment Engineers are responsible for managing the technical aspects of equipment and vendor engagement, planning, scheduling, and implementing new tool installations, relocations, and retrofits as well as optimizing existing tool performance. Additional responsibilities include, but are not limited to:
Completing all required safety training and ensure all work is conducted in accordance with F68 safety policies
Managing equipment vendor Continuous Improvement Projects (CIP) and addressing gaps to improve equipment performance.
Managing equipment performance and facilitating the development of the equipment owners
Partnering with equipment vendors and holding them accountable to projects and deliverables
Partnering with equipment vendors and the Intel network to identify technology roadmaps (emerging technology and obsolescence)
Managing program/project rollouts dealing with equipment improvement activities and providing updates
Identifying and proposing area equipment projects with clear goals and objectives
Identifying gaps in tool matching and partnering with equipment owners to find and resolve root cause
Tracking the successes of programs/projects and identifying/addressing gaps in effectiveness
Monitoring warranty status and following up on issues
Preparing for and driving area vendor regular meetings
Researching and identifying global area equipment BKMs and aligning local processes
Coordinating tool install schedules and following up on issues
Attending factory meetings to report on install status and following up on capacity issues
Establishing timelines and milestones for equipment installs, upgrades, and sustaining projects
Participating in applicable area, vendor, fab and facilities meetings
Identifying equipment BKMs and lessons learned and sharing finding with stakeholders
Developing new resources to address area equipment reporting gaps
Coordinating vendor training events and assisting leadership with equipment engineering development needs
Assist in the creating of new equipment training and documentation
Attending daily passdown meetings and communicate current/upcoming tool issues and mitigation plans
Managing flexibility to be on call to address shift needs
Reducing defects, improving tool availability, and finding solutions to ongoing problems
Identifying, quantifying, and qualifying cost reduction projects
Creating reports summarizing equipment availability, variability, improvements, and cost reduction projects
Supporting and maintaining good housekeeping activities in the working area
Inside this Business Group
Advanced understanding of semiconductor equipment and processes
Proven ability to communicate and present effectively
Advanced project management and time management skills
Proven change management skills
Proven ability to troubleshoot complex problems and address root causes
Advanced data extraction, analysis, and reporting skills
Strong partnering and teamwork skills
Proven ability to manage vendor relationships and achieve a high degree of execution
Advanced PC skills including Microsoft Word, PowerPoint, and Excel
Proven ability to multi-tasking complex projects and execute based on priority
Proven ability to engage large groups and single individuals on highly technical materials
Demonstrated ability to interface with team members at all levels of the organization
Proven ability to mentor and coach team members
Hands-on experience with Wet Processing semiconductor process and equipment.
Demonstrated problem solving skills and ability to work in diverse team environment
Demonstrated experience in experimental design and Statistics.
Working knowledge of technical development, as well as demonstrated experience establishing and maintaining successful relationships with partner organizations, internal and external, to drive aggressive roadmaps
Demonstrated passion towards innovation and risk-taking in order to achieve excellence.
Experience in transfer, start up, and ramp of a high volume manufacturing facility, preferably running 300mm wafer fab processes.
Education and Experience:
Bachelor degree or above in an engineering related field or equivalent experience.
At least 7 years above of semiconductor experience is required.
Previous direct equipment experience of single wafer wet processing on Lam DV-Prime or TEL Wet Bench tools preferred.
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.