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Job ID: JR0001925
Job Category: Engineering
Primary Location: Hillsboro, OR US
Other Locations:
Job Type: Experienced Hire

Manufacturing TD Engineer

Job Description
The solder paste print module engineer owns the SMT paste print and inspection process and equipment technology development in support of the certification of Intel next generation packaging solutions and the assembly of Intel phone, tablet reference designs and other proof of concept prototypes. The solder paste print module consists of Solder Paste Print, Jetting, and Paste Volume Inspection equipment. The solder paste print module engineer defines and establishes the recipes verified by inspection metrology techniques, defines procedures, specs as well as selects and develops tooling, fixtures, and equipment for the solder paste print process to meet quality, reliability, cost, and manufacturability requirements. He or she works with product engineers and the new Intel component platform owners to plan and conduct experiments to fully characterize the SMT solder paste print process for new packages and product circuit board assemblies. Other responsibilities include driving improvements on yield, process stability/capability, productivity and safety/ergonomic over variables such as material, process method, equipment, and operations. The solder paste print module engineer is expected to develop solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools. He or she may also be responsible for training production and partner site process engineers for the transfer of new technologies to other factories. The solder paste print module owner is also responsible for engaging with equipment suppliers and the industry to drive improvements in SMT solder paste print and inspection equipment to meet the SMT requirements for Intel components.


Qualifications

The position requires a degree in Material Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or related discipline (Master's or PhD degree preferred). Minimum of 7 years engineering work experience in electronics SMT and system manufacturing and/or circuit board assembling technology development (TD) is required. The ideal candidate will have an understanding of surface mount technologies to assemble printed circuit boards, which utilizes processes related to solder paste screen printing, component placement, SMT reflow, wave solder and test. The role requires use of FMEA, SPC, statistical and data analysis methods. The candidate must have strong communication, teamwork, problem solving and detail orientation skills. Additional qualifications include: - Ability to work across multi culture and/or multi geography- Strong interpersonal skills- Technical leadership and problem solving skills - Excellent communication skills

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth


Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.
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