Inside this Business Group
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.Minimum Qualifications:The candidate must possess a Ph.D. in Materials Science, Chemistry, Chemical Engineering, or any other electronics packaging related field.Minimum of :- 6 months of experience with metals and alloys (especially solders), micro- macro structures and phase diagrams.Preferred Qualifications:- Knowledge of mechanical metallurgy, thermodynamics-kinetics of metallurgical reactions, coupling and interaction of dissimilar metals.- Knowledge of physical-chemical-thermal-mechanical properties of metallic materials.- Understanding of metrologies for characterization of metallic materials (surface-bulk).- Knowledge of interactions of solders with surface finishes and structure-property-performance of intermetallics.- Understanding of interactions of metallic materials with Polymeric materials.
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth