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Job ID: JR0814822
Job Category: Materials
Primary Location: Tokyo, SRW JP
Other Locations:
Job Type: Experienced Hire

Materials Engineer

Job Description
Job Description: This position present an excellent opportunity for a highly motivated technical contributor to excel in interconnect substrate supplier management and High Volume Manufacturing (HVM) operation management. Roles responsibilities include managing supplier HVM performance, lead continuous improvement, partnering with QR to maintain high quality and robust HVM operation in supplier. Creates relevant specifications to minimize variability and supplier capability requirements. Works together with suppliers to define requirements and holds suppliers accountable for their manufacturing process flow/control and inspections to meet quality, reliability, cost, yield and manufacturability requirements. Drives continuous process, quality, yield and productivity improvements.


1. BS, MS, or PhD in science or engineering fields with minimum 5 years of experience in semiconductor (Fab, Substrate, Assembly) development or manufacturing environment is required. 2. Strong skill required for supplier management, quality management, analytical problem solving, and influence in relevant fields of HVM. 3. In-depth knowledge required on substrate manufacturing processes operations, raw materials, packaging technologies, and quality process control system. 4. Fluent communication in English and Japanese, excellent presentation skill, good internal and external stakeholder management, ability to work in cross functional teams are required

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

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