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Job ID: JR0811538
Job Category: Intern/Student
Primary Location: Shanghai, Shanghai CN
Other Locations:
Job Type: Intern

Memory (NAND) Test Develop Intern

Job Description
NSG is one of the fastest growth businesses at Intel. This position will provide you the opportunity to be part of Intel's fast growing team, work on industry's latest memory technology and NSG's high performance, revolutionary 3D NAND/ Enterprise SATA/PCIe SSD (Solid State Drive) products. You will be responsible for Product Test Development and be the focal person to provide Manufacture Engineering Support to our ODM at Hsinchu area. You need to understand the whole NAND/SSD testflow and test contents, own part of the Test Code developments, ensure robust test coverage & cost-effective manufacture process optimization, HW/SW/FW issue debug, initial failure analysis, yield monitoring & data analysis, etc. for both NAND and SSD products. You need to collaboate with cross-functional team of Product Development Engineering, Systems Firmware Engineering, Manufacture Operation and ODM stakeholdes, to achieve above goals.


Minimum Requirement:- Bachelor/Master degree in Electrical Engineering or Computer Science, etc.- Fluent in Oral/Written English.- C/C++ coding experience.- Quick Learning Skills.Preferred Qualifications: - Familiar with PC system, Windows/Linux applications.- Industry experience in SATA/SAS/PCIe SSDs.

Inside this Business Group

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

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