Inside this Business Group
Qualifications:The ideal candidate will have a BS or MS in Electrical Engineering with 5+ years of HTOL/Burn-in systems and stress development, DFT/DFx for Burn-in, RF circuit constraints, and a proven track record of effective collaboration between engineering organizations. You will use your strong problem solving skills and knowledge of rf circuits and HTOL/BI systems to bridge between external and internal solutions and organizations. Experience with Incal, SH2, or LCBI stress systems is a plus. This is a position of influence, spanning multiple engineering disciplines, geographical teams/cultures, and customers. Your and the team's conclusions will direct business decisions. As such, you will rely on your strong organization skills, attention to detail, and communication skills [both written and oral]. Additional qualifications or advantages include: Successful track record of Influence through: Impact/Initiative/Inertia/Innovation/Intensity/Impatience/Inclusion/Instructing othersSuccessful track record of leading small teams to achieve maximum business impactAbility to drive solutions and lead teams that support business models where Intel is both a leader and a new entrant. Technical problem solving, communications, and time management skills Broad technical and teamwork skillsKnowledge and/or experience both internal [ATM/HVM] and external stress solutionsWorking knowledge of stress pattern conversion and debugKnowledge and/or experience in CAD and/or EDA includes UNIX*, Cadence*, Allegro*, VtpSim*, VHDL, Verilog, and H-Spice* environments Experience with RF, serial transceivers, or Media Access Control (MAC) components
The Platform Engineering Group (PEG) is responsible for the design, development, and production of system-on-a-chip (SoC) products that go into Intel’s next generation client and mobile platforms. PEG strives to lead the industry moving forward through product innovation and world class engineering.