This is a mechanical engineering analysis position in the Client Computing Group. This group develops thermal / mechanical enabling solutions to support the Client Silicon Roadmap. The thermal / mechanical solutions take the form of system design guides, system guidance, thermal power system management, and heatsink designs. The principal responsibility of this position is to apply and communicate predictive structural methods/results as a collaborating member of a multi-disciplinary product development team.
Inside this Business Group
The qualified candidate will have MS in Mechanical Engineering (Ph.D. preferred), with some demonstrated experience in Finite Element Analysis.Minimum Qualifications:Minimum 4 years of experience in: - Preliminary and detailed stress analysis (to include fatigue, elastic stability, fracture mechanics)- Mechanical development testing and instrumentation, model correlation, linear and non-linear finite element methods- Dynamic analyses (random vibration, transient shock, etc
The Client Computing Group is responsible for all aspects of the client computing business across Phone, Phablet, Tablet and PC platforms, leading Intel's efforts to transform client computing through technologies, new form factors, and driving Intel's corporate-wide user experience initiatives. This spans all client device brands including hardware, software and connectivity ingredients for phones, tablets, Ultrabook™, All-in-Ones, 2 in 1 computing devices, and home gateways.