In this position, you will be a wafer fabrication process engineer in one of two 300mm factories in Aloha Factory Operations (AFO) in Oregon. The two AFO factories specialize in either back end wafer fabrication (thin films deposition, lithography, etch, electroplating) or wafer testing. You will be sustaining leading edge processes and tools while processes ramp from development into high volume.
What you’ll do
As a Module Process Engineer at Intel, you will be responsible for identifying, responding to, and characterizing process tool and defect problems, implementing root cause solutions to those problems, and continuously improving your toolset's safety, quality, velocity, and cost performance.
You will also be responsible for:
The ideal candidate should exhibit the following behavioral traits:
This is an entry level position and will be compensated accordingly.
This US based position does not experience a shortage of qualified U.S. Workers. Intel limits its sponsorship of individuals possessing temporary work authorization or requiring a visa to those positions for which we experience a shortage of qualified and available U.S. Workers. A U.S. Worker is someone who is either a US Citizen, U.S. National, U.S. Lawful Permanent Resident, or a person granted Refugee or Asylum status by the U.S. Government.
What we offer you
We're constantly working on making a more connected and intelligent future, and we need your help. Change tomorrow. Start today.
Minimum Qualifications: Must have a legal or permanent right to work in the US without requiring sponsorship. Additional Qualifications:
Qualifications
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth